WS-486 Wasserwaschbare Lötcreme Technisches Datenblatt |
zurück zur WS 400 übersicht | |||
WS-486 Serie (Wasserwaschbare Lötcreme) The 486 Series is a fourth generation product designed for SMT assemblies where post reflow cleaning is performed with water alone. This non-resin formula was developed to replace earlier water-soluble creams, containing no insoluble components. Excellent printability and stencil life is obtained for the most demanding applications, including hard-to-solder metalizations and harsh operating environments.
RECOMMENDED CLEANING 40-50 PSI at 50-60° C. Rough rinse cycle of soft water. Final rinse of DI water. No saponifier or other chemicals needed. CREAM PROPERTIES While SIR and IONIC contamination results will vary with board design, component density and cleaning machine efficiency, the following results are typical of the 400 Series creams. Ionic Contamination:
SIR:
Copper Mirror:
Silver Chromate Paper Test:
Water Extract Resistivity:
Tackiness vs. Time Exposure:
Viscosity
|
RECOMMENDED REFLOW
|
For additional information contact your local AMTECH representative or call the Technical Service department direct at LICO Tel +43 1 706 43 000
This information contained herin is based on technical data which we believe to be reliable and is intended for use by persons having technical skill, at their own discretion and risk. Users of out products should make their own tests to determine the suitability of each such product for their own particular process. AMTECH will assume no liability for results obtained or damages uncurred throught the application of the data presented.
© 1995-2000 AMTECH Inc.