NC-557 No-Clean Solder Cream Technical Data Sheet |
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NC-557 Series (No-Clean Solder Cream) The 557 Series is designed to meet requirements for reliable solder joints in SMT PC Board assemblies. This cream was formulated to replace RMA and water soluble solder creams with the benefits of eliminating the added steps of potentially hazardous and costly solvent cleaning and DI water cleaning. This formula was designed to have a wider process window and better compatibility with OSP's than previous No-Clean formulations.
CREAM PROPERTIES Copper Mirror
Silver Chromate Paper Test:
SIR:
Water Extract Resistivity:
Viscosity
Ionic Contamination
Printability
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RECOMMENDED REFLOW
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This information contained herein is based on technical data which we believe to be reliable and is intended for use by persons having technical skill, at their own discretion and risk. Users of our products should make their own tests to determine the suitability of each such product for their own particular process. AMTECH will assume no liability for results obtained or damages incurred through the application of the data presented.
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